METHOD OF MANUFACTURING WIRING SUBSTRATE

A method for manufacturing a wiring substrate according to the present invention includes the steps of preparing a support substrate (8) with a product formation region (X) and a waste edge region (Y); preparing a separable metal foil (10) whose area is larger than the area of the product formation...

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Bibliographic Details
Main Authors YASUDA MASAHARU, NARUMI DAISUKE, NAKATOMI YOSHINORI
Format Patent
LanguageEnglish
Korean
Published 08.07.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method for manufacturing a wiring substrate according to the present invention includes the steps of preparing a support substrate (8) with a product formation region (X) and a waste edge region (Y); preparing a separable metal foil (10) whose area is larger than the area of the product formation region (X) and is smaller than the area of the support substrate (8); burying and fixing the separable metal foil (10) on the support substrate (8); forming a buildup part (13) on the buried separable metal foil (10); cutting the support substrate (8), the separable metal foil (10), and the buildup part (13) together; obtaining a laminate (14) which is composed of a second metal foil (10b) and the buildup part (13) by separating a first metal foil (10a) from the second metal foil (10b); and forming a wiring conductive layer (2a) by removing a part of the second metal foil (10b).
Bibliography:Application Number: KR20130146263