UV DICING FILM FOR SEMICONDUCTOR DEVICE

• Main Authors: UHM, TAI SOO, CHA, SE YOUNG, SEO, GI BONG, KIM, YOUNG WOOK
• Format: Patent
• Language: English; Korean
• Published: 08.07.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to an ultraviolet (UV)-curing dicing film which prevents peeling failures when the film is attached to a wafer, and dicing errors during a laser dicing operation after the film is attached to the wafer, and is easily picked up after a UV illumination. The UV-curing dicing film for a semiconductor is a dicing film having a base film, an adhesive layer, and an adhesive protective film, which are sequentially stacked, which is characterized in that thicknesses of the base film and the adhesive layer satisfy the following equation: C = A/B, 0.09 < C < 0.43, wherein A is the thickness of the adhesive layer, B is the thickness of the base film, and C is a thickness ratio between the adhesive layer and the base film. The UV-curing dicing film for a semiconductor configured as above according to the present invention is a UV-curing dicing film for a semiconductor having the base film of the dicing film, the adhesive, and the protective film, which simply solves conventional problems by optimizing thicknesses of the base film and the adhesive such that the film is easily picked up and dicing burrs occurring during a dicing process are minimize, thereby enhancing operation stability and operation yields.