REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION METHOD, AND SEMICONDUCTOR DEVICE

• Main Authors: SUZUKI NAOYA, TAKANO NOZOMU, YAMASHITA YUKIHIKO, MIYAUCHI KAZUHIRO
• Format: Patent
• Language: English; Korean
• Published: 04.07.2014
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.