LED PACKAGE WITH IMPROVED THERMAL CONDUCTIVITY AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: AHN, SU CHANG, LEE, JIN HONG, PARK, JIN YOUNG, JANG, YEONG HUN, KIM, WANG GI
• Format: Patent
• Language: English; Korean
• Published: 27.06.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The objective of the present invention is to provide an LED package with improved thermal conductivity and a method for manufacturing the same, which are capable of easily emitting heat generated in an active layer through solder balls and electrode pads having wide areas so that a thermal impact of an LED chip can be improved. To achieve the objective, the LED package with improved thermal conductivity comprises: a substrate part having a via hole formed therein; a filling part which is inserted into the via hole to conduct heat; a first upper electrode pad which is formed on the upper surface of the substrate part and has a larger area than an LED chip to emit light; a second upper electrode pad which is formed on the upper surface of the substrate part and is spaced apart from the first upper electrode pad at certain intervals; lower electrode pads which are formed on the lower part of the substrate part and are respectively connected to the first and second upper electrode pads through the filling part; the LED chip which is installed in the upper part of the substrate part to emit light; and solder balls which are electrically connected to the first and second upper electrode pads, wherein the heat generated in the LED chip is directly transferred to the first and second upper electrode pads through the solder balls. Therefore, the LED package is configured to easily emit the heat generated in an active layer of the LED chip through the solder balls and the electrode pads, thereby improving a thermal impact of the LED chip, protecting the LED chip from being damaged by the heat; and preventing a decrease of lifespan.