PRINTED CIRCUIT BOARD

A printed circuit board according to the present invention can reduce warpage deformation due to the difference of the thermal expansion rate of a circuit pattern in the same layer by forming a filling material of a similar thermal expansion rate to the circuit pattern in its surface and between the...

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Bibliographic Details
Main Author CHO, SUK HYEON
Format Patent
LanguageEnglish
Korean
Published 25.06.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board according to the present invention can reduce warpage deformation due to the difference of the thermal expansion rate of a circuit pattern in the same layer by forming a filling material of a similar thermal expansion rate to the circuit pattern in its surface and between the circuit patterns. Also, a stack body having a lower expansion rate compared to the filling material is formed in one surface of the filling material. Therefore, the entire coefficient of thermal expansion of a PCB is reduced. Because it has a lower coefficient of thermal expansion, it can easily bond an insulating material of little flowability.
Bibliography:Application Number: KR20120147506