SEALANT COMPOSITION
A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acry...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
19.06.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent. |
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Bibliography: | Application Number: KR20147006744 |