MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Authors: KIM, HYUNG KYU, KIM, IN WOOK, JUNG, SOO IM, PARK, KWANG SEOK
• Format: Patent
• Language: English; Korean
• Published: 18.06.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to a multilayer printed circuit board which includes an insulation resin sheet and a manufacturing method thereof. The insulation resin sheet includes a prepreg and an insulation resin layer which is formed on one side of the prepreg and is able to form an illuminance by a desmear process. The insulation resin layer includes: (a) a polyphenylene ether modified resin which is obtained by redistributing polyphenylene under the existence of 9,9-bis (hydroxy-aryl)-fluorene (BCF); (b) an epoxy resin; (c) a hardener; (d) modified epoxy resins of one or more types which are selected from a group which is formed with a dimeric acids modified epoxy resin and an urethane modified epoxy resin; and (e) an insulation resin sheet which is formed by hardening a thermosetting resin composition which includes a flame retardant. The present invention is able to provide a build-up printed circuit board which is able to form a high density microcircuit pattern while not only reducing a whole laminated thickness but also lowering an interlayer thermal expansion coefficient.