POLISHING SYSTEM AND POLISHING METHOD

A polishing system for polishing a semiconductor wafer includes a wafer supporting unit for holding the semiconductor wafer, and a first polishing pad for polishing the region of the semiconductor wafer. The semiconductor wafer has a first diameter. The first polishing pad has a second diameter whic...

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Bibliographic Details
Main Authors WU CHIH JEN, LIN SHIH CHI, YANG CHIH YUAN, HONG MIN HAO, CHOU YOU HUA, HUANG CHEN MING, LEE CHIH TSUNG, HUANG SOON KANG, CHAN CHIN HSIANG, WU KUN TAI
Format Patent
LanguageEnglish
Korean
Published 16.06.2014
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A polishing system for polishing a semiconductor wafer includes a wafer supporting unit for holding the semiconductor wafer, and a first polishing pad for polishing the region of the semiconductor wafer. The semiconductor wafer has a first diameter. The first polishing pad has a second diameter which is shorter than the first diameter.
Bibliography:Application Number: KR20130023785