SUBSTRATE TREATING APPARATUS AND METHOD

The present invention relates to a substrate processing apparatus and a method thereof and, more specifically, to an apparatus and a method for cleaning a nozzle which applies a process fluid to a substrate and an apparatus and a method for processing a substrate comprising the same. The substrate p...

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Bibliographic Details
Main Authors PARK, GIL SOO, AHN, HEE MAN
Format Patent
LanguageEnglish
Korean
Published 05.06.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a substrate processing apparatus and a method thereof and, more specifically, to an apparatus and a method for cleaning a nozzle which applies a process fluid to a substrate and an apparatus and a method for processing a substrate comprising the same. The substrate processing apparatus, according to an embodiment of the present invention, comprises a processing unit for performing a process of treating the process fluid to the substrate; a nozzle unit including a nozzle for spraying the process fluid to the substrate; and a nozzle cleaning unit for cleaning the nozzle. The nozzle cleaning unit comprises a cleaning module including a container for providing a space for the cleaning process and a plurality of fluid moving lines connected to a plurality of microporuous formed on the upper surface.
Bibliography:Application Number: KR20120135417