MULTI LAYER PCB AND METHOD FOR MANUFACTURING THEREOF

The present invention relates to a multi-layer printed circuit board used for a probe card for an automatic test of a semiconductor, and a method of manufacturing the same. The multi-layer printed circuit board includes an upper plate (100) designed to have laminated layers in the range of 1 to 15;...

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Bibliographic Details
Main Author PARK, JOON PYO
Format Patent
LanguageEnglish
Korean
Published 15.05.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
TESTING
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