MULTI LAYER PCB AND METHOD FOR MANUFACTURING THEREOF

• Main Author: PARK, JOON PYO
• Format: Patent
• Language: English; Korean
• Published: 15.05.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; PRINTED CIRCUITS; TESTING

The present invention relates to a multi-layer printed circuit board used for a probe card for an automatic test of a semiconductor, and a method of manufacturing the same. The multi-layer printed circuit board includes an upper plate (100) designed to have laminated layers in the range of 1 to 15; a middle plate (200) designed to have laminated layers in the range of 1 to 60; a lower plate (300) designed to have laminated layers in the range of 1 to 15; and a non-prepreg (NP) interposed between the upper and middle plates (100 and 200) and between the middle and lower plates (200 and 300). Via holes (400) having the diameter of 0. 4 mm are formed in the upper, middle and lower plates (100, 200 and 300) and a via hole (400′) having a diameter larger than that of the via holes (400) is formed in the non-prepreg (NP). Thus, the multi-layer printed circuit board having 60 layers or more is formed by pressing and heating the upper, middle and lower plates and the non-prepreg. According to the present invention, a high-layer printed circuit board having a laminated layers in the range of 90 or more and a via hole having a critical diameter of 0.4 mm is enabled to be designed so that a high performance product may be implemented.