SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

The present invention relates to a substrate bonding device and a substrate bonding method. The device includes: a die which is placed on a base and arranges and fixes a first substrate entered from the outside; a substrate chucking unit which is placed on the upper part of the die and chucks a seco...

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Bibliographic Details
Main Authors KIM, BYUNG GEUK, MUN, JANG SOO, LEE, JUNG BO, PARK, PIL SUK
Format Patent
LanguageEnglish
Korean
Published 25.04.2014
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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