SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

• Main Authors: KIM, BYUNG GEUK, MUN, JANG SOO, LEE, JUNG BO, PARK, PIL SUK
• Format: Patent
• Language: English; Korean
• Published: 25.04.2014
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

The present invention relates to a substrate bonding device and a substrate bonding method. The device includes: a die which is placed on a base and arranges and fixes a first substrate entered from the outside; a substrate chucking unit which is placed on the upper part of the die and chucks a second substrate entered from the outside to be bonded to the first substrate; a horizontal operation unit which moves the substrate chucking unit horizontally; a first vertical operation unit which is placed on the base, is connected to the horizontal operation unit, and moves the horizontal operation unit vertically; a first and a second pressurization unit which are placed on the substrate chucking unit and pressurizes the second substrate, which is chucked to the substrate chucking unit, towards the first substrate; a second vertical operation unit which moves the first pressurization unit vertically while crossing the first vertical operation unit at right angles; and a third vertical operation unit which is placed on the second vertical operation unit and moves the second pressurization unit vertically.