BARRIER ASSEMBLIES

The present application is directed to an assembly comprising an electronic device and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The weatherable sheet is bonded t...

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Bibliographic Details
Main Authors ROEHRIG MARK A, WEIGEL MARK D, RUFF ANDREW T, DELMORE MICHAEL D
Format Patent
LanguageEnglish
Korean
Published 23.04.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present application is directed to an assembly comprising an electronic device and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The weatherable sheet is bonded to the electronic device.
Bibliography:Application Number: KR20147005195