INSPECTING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

There is provide an inspection apparatus configured to detect a change in shape of a pattern in the depth direction o the pattern, the apparatus including: an illumination section 20 which illuminates a wafer 5 having a periodic pattern with an illumination light having transmittance with respect to...

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Bibliographic Details
Main Author KUDO YUJI
Format Patent
LanguageEnglish
Korean
Published 23.04.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:There is provide an inspection apparatus configured to detect a change in shape of a pattern in the depth direction o the pattern, the apparatus including: an illumination section 20 which illuminates a wafer 5 having a periodic pattern with an illumination light having transmittance with respect to the wafer 5; a reflected diffraction light detecting section 30 which outputs a first detection signal by receiving a reflected diffraction light generated by the pattern on a surface, of the wafer, on an illumination side illuminated with the illumination light; a transmitted diffraction light detecting section 40 which outputs a second detection signal by receiving a transmitted diffraction light generated by the pattern to a back surface, of the wafer, opposite to the illumination side; and a signal processing section 51 which detects a state of the pattern based on at least one of the first and second detection signals.
Bibliography:Application Number: KR20137023438