JIG UNIT FOR FIXING SUBSTRATE AND SUBSTRATE TRANSFERRING APPARATUS INCLUDING THE SAME

• Main Authors: LEE, SUNG JOON, KIM, BYEONG MUN, KIM, GOING SIK, NAM, YOUN CHUL, LIM, SUNG TAEK, LEE, SANG YUP
• Format: Patent
• Language: English; Korean
• Published: 23.04.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention relates to a jig unit for fixing a substrate and an apparatus for transferring a substrate including the same. According to an embodiment of the present invention, the proposed jig unit for fixing a substrate includes: a support part which supports the bottom of the substrates edge; a hinge part which has a hinge at a predetermined height from the top of the substrate supported by the support part, and which rotates, over the extent for vertically pressing the top of the substrate, so as to apply a force to the edge of the substrate; and a substrate fixer which is formed on the end of the hinge part, and which presses the top of the substrate, in accordance with the rotation of the hinge part, at the same time, applying a tensile stress to the edge of the substrate, in order to flatten and fix the substrate on the support part.