DELAMINATION DRYING APPARATUS AND METHOD

A delamination drying apparatus of a substrate is provided. A chamber for receiving the substrate is provided. A chuck is in the substrate and supports and clamps the substrate. A temperature control part controls the temperature of the substrate and cools the substrate. A vacuum pump is hydraulical...

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Bibliographic Details
Main Authors HYMES DIANE, SIRARD STEPHEN M, SCHOEPP ALAN M, LIMARY RATCHANA
Format Patent
LanguageEnglish
Korean
Published 21.04.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A delamination drying apparatus of a substrate is provided. A chamber for receiving the substrate is provided. A chuck is in the substrate and supports and clamps the substrate. A temperature control part controls the temperature of the substrate and cools the substrate. A vacuum pump is hydraulically connected to the chamber. A tilting mechanism makes the chuck lean at an angle of 90 degrees or more. [Reference numerals] (AA) Start; (BB) End; (S104) Form a feature on a substrate; (S108) Wet the substrate; (S112) Move a liquid with dry chemicals; (S116) Place the substrate in a drying chamber; (S120) Provide a controlled atmosphere; (S124) Cool the dry chemicals; (S128) Delaminate solid dry chemicals; (S132) Remove the delaminated solid dry chemicals; (S136) Remove the substrate from the chamber
Bibliography:Application Number: KR20130121423