COMPOSITION SET ELECTROCONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF AND ELECTROCONDUCTIVE BINDING MATERIAL COMPOSITION

• Main Authors: YOKOSAWA SHUNYA, INADA MAKI, KUMASHIRO YASUSHI, NOUDOU TAKAAKI, KURODA KYOKO, NAKAKO HIDEO, YAMAMOTO KAZUNORI
• Format: Patent
• Language: English; Korean
• Published: 17.04.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CONDUCTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

본 발명은, 분산매 및 금속산화물을 포함하는 무기입자를 함유하는 도체층 형성용 조성물과, 바인더재 및 수평균 입자지름이 1nm∼3000nm인 도전성 입자를 함유하는 도전성 접착재 조성물을 포함하는 조성물 세트를 제공한다. The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.