REINFORCED INTERPHASE AND BONDED STRUCTURES THEREOF

Embodiments disclosed herein include a structure comprising an adherend and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and an interfacial material, wherein the adherend is suitable for concentrating the interfacial material in...

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Bibliographic Details
Main Authors HARO ALFRED P, NGUYEN FELIX N, YOSHIOKA KENICHI, ARAI NOBUYUKI
Format Patent
LanguageEnglish
Korean
Published 10.04.2014
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Summary:Embodiments disclosed herein include a structure comprising an adherend and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and an interfacial material, wherein the adherend is suitable for concentrating the interfacial material in an interfacial region between the adherend and the adhesive composition upon curing of the adhesive composition; a method of manufacturing a composite article by curing the adhesive composition and a reinforcing fiber; and a method of manufacturing an adhesive bonded joint comprising applying the adhesive composition to a surface of one of the two or of different kinds the adherend, and curing the adhesive composition to form an adhesive bond between the adherends. The resulting interfacial region, viz., the reinforced interphase, is reinforced by one or more layers of the interfacial material such that substantial improvements in bond strength and fracture toughness are observed.
Bibliography:Application Number: KR20137021168