METHOD OF BONDING SUBSTRATE

• Main Author: KWON, YOUNG JONG
• Format: Patent
• Language: English; Korean
• Published: 02.04.2014
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SPRAYING OR ATOMISING IN GENERAL; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING

A method for bonding a substrate of the present invention comprises the steps of: applying an adhesive solution to one side of a first substrate; contacting the adhesive solution applied on the side of the first substrate to a surface of a second substrate; applying the adhesive solution to the entire one side of the first substrate and the entire surface of the second substrate with a surface tension of the adhesive solution as at least one of the first substrate, and the second substrate moves to the horizontal and vertical directions in the state that the adhesive solution is in contact with the surface of the second substrate; and bonding the first substrate and the second substrate by hardening the adhesive solution. [Reference numerals] (500) Upper stage; (600) Lower stage