WIRELESS MODULE

A wireless multi-chip module includes a lead frame structure (10) having parts for receiving a flip-chip mounted die, an IC (20) for forming a half-bridge circuit capsulated by a molding compound (70), and upper side and lower side MOSFETs. The module is assembled without any bond wire. The module m...

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Bibliographic Details
Main Authors FLORES ALLAN TUNGUL, MANATAD ROMEL N, MANCELITA JAN VINCENT C
Format Patent
LanguageEnglish
Korean
Published 17.03.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A wireless multi-chip module includes a lead frame structure (10) having parts for receiving a flip-chip mounted die, an IC (20) for forming a half-bridge circuit capsulated by a molding compound (70), and upper side and lower side MOSFETs. The module is assembled without any bond wire. The module may include passive components which include an external input capacitor (150) or an inner input capacitor (350).
Bibliography:Application Number: KR20130107936