INSULATION COMPOSITION FOR MULTILAYERED PRINTED CIRCUIT BOARD, AND MULTILAYERED PRINTED CIRCUIT BOARD COMPRISING INSULATION LAYER THEREOF

• Main Authors: SHIM, JI HYE, JEON, KEE SU, LEE, HWA YOUNG, JUNG, HYUNG MI
• Format: Patent
• Language: English; Korean
• Published: 12.03.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES

The present invention relates to an interlayer insulation composition for a multilayer printed circuit board comprising: an epoxy-based resin including a naphthalene deformation epoxy resin, a cresol novolac epoxy resin and a rubber deformation epoxy resin; a thermoplastic resin; a curing agent; a hardening accelerator; and an inorganic filler, and a multilayer printed circuit board comprising the same as an insulation layer. The present invention is able to provide an insulation composition which exhibits excellent adhesive strength of an insulation layer and a Cu layer in order to secure reliability and operate a final board normally. Additionally, the present invention is able to secure the reliability of the board, even when the content of the inorganic filer is increased, by maintaining a low coefficient of thermal expansion by including appropriate amounts of epoxy resins and thermoplastic resins and increasing toughness of an insulation film without brittleness. [Reference numerals] (AA) Exfoliation (mm/mm); (BB) Example 2; (CC) Comparative example 2