PLASMA PROCESSING APPARATUS

A plasma processing apparatus includes a planar antenna member, which introduces electromagnetic waves generated by means of an electromagnetic wave generator into a processing chamber; a waveguide which supplies the electromagnetic waves to the planar antenna member; and a wave retardation plate, w...

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Bibliographic Details
Main Authors ADACHI HIKARU, OZAKI SHIGENORI, OTA RYUSAKU, ISHITSUBO MAKOTO
Format Patent
LanguageEnglish
Korean
Published 17.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A plasma processing apparatus includes a planar antenna member, which introduces electromagnetic waves generated by means of an electromagnetic wave generator into a processing chamber; a waveguide which supplies the electromagnetic waves to the planar antenna member; and a wave retardation plate, which is provided on the planar antenna member, and changes the wavelength of the electromagnetic waves supplied from the waveguide; a cover member which covers the wave retardation plate and the planar antenna member from above. The wave retardation plate is configured using a dielectric material, and the permittivity of the region between the planar antenna member and the cover member is not uniform on the plane parallel to the upper surface of the planar antenna member.
Bibliography:Application Number: KR20147002619