WIRELESS LAN MODULE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

The present invention relates to a wireless LAN module assembly and a manufacturing method therefor. According to one embodiment of the present invention, the wireless LAN module assembly includes a wireless LAN module; a resin layer formed in the wireless LAN module; an active layer formed on the s...

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Bibliographic Details
Main Author PARK, HYUN DO
Format Patent
LanguageEnglish
Korean
Published 17.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TRANSMISSION
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Summary:The present invention relates to a wireless LAN module assembly and a manufacturing method therefor. According to one embodiment of the present invention, the wireless LAN module assembly includes a wireless LAN module; a resin layer formed in the wireless LAN module; an active layer formed on the surface of the resin layer; and a metal layer formed on the active layer and shielding an electromagnetic wave which is harmful to the wireless LAN module.
Bibliography:Application Number: KR20120085882