SEMICONDUCTOR PACKAGE AND METH1OD OF FORMING TH1E SAME

The present invention provides a semiconductor package and a method for manufacturing the same. A package substrate according to the present invention includes holes to allow a mold layer to cover the lower surface of the package substrate through the holes. The plane shape of the mold layer for cov...

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Bibliographic Details
Main Authors CHEON, SEUNG JIN, KWON, HEUNG KYU
Format Patent
LanguageEnglish
Korean
Published 11.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a semiconductor package and a method for manufacturing the same. A package substrate according to the present invention includes holes to allow a mold layer to cover the lower surface of the package substrate through the holes. The plane shape of the mold layer for covering the lower surface of the package substrate is vertically and horizontally symmetrical around the holes.
Bibliography:Application Number: KR20120084072