BONDING ACCELERATING APPARATUS, METHOD OF BONDING ACCELERATION USING THE SAME AND BIOSENSOR, BIOSENSOR ARRAY AND SENSING METHOD USING THE SAME

A bonding stimulating apparatus prepared by the present invention comprises: a first electrode; a second electrode which is separated from the first electrode; a channel unit whose one part is electrically connected with the first electrode and whose the other part is electrically connected with the...

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Bibliographic Details
Main Authors WOO, JUN MYUNG, PARK, YOUNG JUNE, KIM, SEOK HYANG, AHN, JIN HONG
Format Patent
LanguageEnglish
Korean
Published 06.02.2014
Subjects
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Summary:A bonding stimulating apparatus prepared by the present invention comprises: a first electrode; a second electrode which is separated from the first electrode; a channel unit whose one part is electrically connected with the first electrode and whose the other part is electrically connected with the second electrode; a stimuli source which is electrically connected with the channel unit in order to apply electric stimuli; and a probe which is connected with the channel unit in order to complementarily combined with a target material being sensed.
Bibliography:Application Number: KR20120118887