PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A printed circuit board according to an embodiment of the present invention includes: a first insulation layer which includes at least one through pillar, a plurality of insulation layers which are laminated by including at least one circuit layer and at least another pillar connected to the through...

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Bibliographic Details
Main Authors KANG, MYUNG SAM, KANG, SEON HA, KIM, DA HEE
Format Patent
LanguageEnglish
Korean
Published 05.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board according to an embodiment of the present invention includes: a first insulation layer which includes at least one through pillar, a plurality of insulation layers which are laminated by including at least one circuit layer and at least another pillar connected to the through pillar in one or both directions of the first insulation layer, and a plurality of outermost circuit layers which are in contact with the pillar formed on the outermost insulation layer among the insulation layers.
Bibliography:Application Number: KR20120080733