APPARATUS FOR INSPECTING DEFFECTS OF SHEET-SHAPED PRODUCTS WITH OPTICAL FILMS, DATA PROCESSING APPARATUS THEREOF, CUTTING APPARATUS THEREOF AND PRODUCT SYSTEM THEREOF

• Main Author: OHASHI HIROMICHI
• Format: Patent
• Language: English; Korean
• Published: 03.02.2014
• Subjects: CONVEYING; HANDLING THIN OR FILAMENTARY MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER; MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER; MEASURING; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PACKING; PERFORMING OPERATIONS; PHYSICS; STORING; TESTING; TRANSPORTING; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER

(Task) The objectives of the present invention are to improve yield rate, reduce manufacturing costs, and enhance productivity significantly by using the determination conditions of each user. (Method of solution) A defect inspection device (10) for inspecting defects in a sheet product including an optical film which is a component of an optical display device includes: a defect detection unit which detects defects in a single-layer body and/or a multi-layer stack which makes up a sheet product while a protective layer is not formed on the surface of the sheet product; and a defect data generation unit which generates defect data which is about the defects detected by the defect detection unit. The defect data is used in manufacturing a single wafer sheet product. [Reference numerals] (10) Defect inspection device; (11) Polarizer inspection unit; (12) Polarizing plate inspection unit; (13) Separator inspection unit; (14) Protection film inspection unit; (15) Defect data generationi unit; (16,22,42) Storage unit; (17,34) Defect data formation unit; (18,26,46) Display control unit; (19,27) Abnormality determination unit; (20) First inspection data processing device; (21,31,41,51) Acquisition unit; (23,43) Yield rate calculation unit; (24,44) Disk setting unit; (25,45) Input registration unit; (30) Slit cutting device; (32,52) Defect data reading unit; (33,53) Cutting unit; (40) Second inspection data processing device; (47) Cutting position data generation unit; (50) Single wafer cutting device; (54) Product data formation unit