SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD

Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a first conductor pad and a passivation structure. A second conductor pad is fabricated around b...

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Bibliographic Details
Main Authors TOPACIO RODEN R, SU MICHAEL Z, MCLELLAN NEIL
Format Patent
LanguageEnglish
Korean
Published 03.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a first conductor pad and a passivation structure. A second conductor pad is fabricated around but not in physical contact with the first conductor pad to leave a gap. The second conductor pad is adapted to protect a portion of the passivation structure.
Bibliography:Application Number: KR20137025186