METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD

The present invention is characterized by semi-curing resins with heat in order for components to be fixed to the inside of a cavity without completely heat-curing the resins by controlling the time and the temperature of heat curing in a step of filling and heat-curing an empty space of the cavity...

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Bibliographic Details
Main Authors LEE, MIN SEOK, LEE, HAN SUNG, LEE, YONG BIN, YOON, KWAN SUN, KO, YOUNG JOO
Format Patent
LanguageEnglish
Korean
Published 16.01.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention is characterized by semi-curing resins with heat in order for components to be fixed to the inside of a cavity without completely heat-curing the resins by controlling the time and the temperature of heat curing in a step of filling and heat-curing an empty space of the cavity by covering resins on one side of a board in order for the components mounted on the inside of the cavity to be fixed. Moreover, the present invention is characterized by detaching and removing a tape used for fixing the components, laminating the resins on the opposite side of the board, and performing a complete hardening process with the resins which is semi-cured in a previous step.
Bibliography:Application Number: KR20120073149