METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD
The present invention is characterized by semi-curing resins with heat in order for components to be fixed to the inside of a cavity without completely heat-curing the resins by controlling the time and the temperature of heat curing in a step of filling and heat-curing an empty space of the cavity...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
16.01.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention is characterized by semi-curing resins with heat in order for components to be fixed to the inside of a cavity without completely heat-curing the resins by controlling the time and the temperature of heat curing in a step of filling and heat-curing an empty space of the cavity by covering resins on one side of a board in order for the components mounted on the inside of the cavity to be fixed. Moreover, the present invention is characterized by detaching and removing a tape used for fixing the components, laminating the resins on the opposite side of the board, and performing a complete hardening process with the resins which is semi-cured in a previous step. |
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Bibliography: | Application Number: KR20120073149 |