COMPOSITION, INSULATING FILM MADE THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARDS HAVING THE SAME

• Main Authors: SHIM, JI HYE, JUNG, HYUNG MI, PARK, YONG JIN
• Format: Patent
• Language: English; Korean
• Published: 08.01.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to an epoxy resin composition, a multilayer printed circuit board using the same and a manufacturing method thereof and, more specifically, to an epoxy resin composition for insulating one layer from another capable of forming surface roughness by using the difference in initial curing temperatures in a multilayer printed circuit board using a build-up method; and a method for manufacturing a multilayer printed circuit board having multiple layers formed by insulating the inner circuits formed of copper (Cu) by using the epoxy resin composition as an insulating layer.