METHOD OF FABRICATING SPINDLE WITH IMBEDDED COPPER CIRCUIT

• Main Author: KIM, OCK HYUN
• Format: Patent
• Language: English; Korean
• Published: 06.01.2014
• Subjects: BORING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING; TURNING

A method for manufacturing a spindle having a bonded copper circuit is disclosed. The present invention comprises the steps of: forming multiple slit grooves at the center of a spindle and forming circular grooves in both ends of the multiple slit grooves; forming a spindle assembly by inserting copper wires in the multiple slit grooves and a pair of semi-circular copper rings in the circular grooves; preparing a cylindrical press-fitting container having a center hole; press-fitting a spindle assembly in the center hole of the cylindrical press-fitting container with a press; putting the spindle assembly fitted in the cylindrical press-fitting container in a heat treating furnace to thermally treat the spindle assembly to be diffusion-welded; separating the thermally treated spindle assembly from the cylindrical press-fitting container; and precisely processing the spindle assembly in which the copper wires and the copper rings are attached to the spindle by the diffusion welding process. The present invention can endure strong centrifugal force at high temperatures and can attach the copper circuit not to be separated from the spindle.