LOW TEMPERATURE CURABLE EPOXY TAPE AND METHOD OF MAKING SAME
A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
30.12.2013
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Subjects | |
Online Access | Get full text |
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Summary: | A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided. |
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Bibliography: | Application Number: KR20137006629 |