UV CURING SYSTEM FOR SEMICONDUCTORS
The present invention relates to an ultraviolet ray (UV) curing system for processing a semiconductor substrate such as a wafer. The UV curing system comprise; a processing chamber; a wafer supporting body for accepting the wafer within the processing chamber; a UV radiation source arranged on the p...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
11.12.2013
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Abstract | The present invention relates to an ultraviolet ray (UV) curing system for processing a semiconductor substrate such as a wafer. The UV curing system comprise; a processing chamber; a wafer supporting body for accepting the wafer within the processing chamber; a UV radiation source arranged on the processing chamber; and a UV penetrability window arranged between the UV radiation source and the wafer supporting body. The wafer supporting body is provided by a belt conveyor which is operated to transfer the wafer through the processing chamber during UV curing in one example. The UV radiation source is a movable lamp unit which moves across the top of the processing chamber for irradiating the wafer in the other example. The UV penetrability window comprises a UV radiation corrector in the other example. The UV radiation corrector decreases the intensity of UV radiation for a part of the wafer located under the UV radiation corrector. Various examples improve wafer curing uniformity by normalizing a UV intensity level for the wafer. [Reference numerals] (122) UV lamp;(130) Explanation window;(AA) Cooling gas;(BB) Cooling / cleaning gas;(CC) Vacuum source |
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AbstractList | The present invention relates to an ultraviolet ray (UV) curing system for processing a semiconductor substrate such as a wafer. The UV curing system comprise; a processing chamber; a wafer supporting body for accepting the wafer within the processing chamber; a UV radiation source arranged on the processing chamber; and a UV penetrability window arranged between the UV radiation source and the wafer supporting body. The wafer supporting body is provided by a belt conveyor which is operated to transfer the wafer through the processing chamber during UV curing in one example. The UV radiation source is a movable lamp unit which moves across the top of the processing chamber for irradiating the wafer in the other example. The UV penetrability window comprises a UV radiation corrector in the other example. The UV radiation corrector decreases the intensity of UV radiation for a part of the wafer located under the UV radiation corrector. Various examples improve wafer curing uniformity by normalizing a UV intensity level for the wafer. [Reference numerals] (122) UV lamp;(130) Explanation window;(AA) Cooling gas;(BB) Cooling / cleaning gas;(CC) Vacuum source |
Author | CHOU YOU HUA LIEN MING HUEI CHEN CHIA HO LEE CHIH TSUNG WU SHU FEN |
Author_xml | – fullname: CHEN CHIA HO – fullname: LIEN MING HUEI – fullname: CHOU YOU HUA – fullname: WU SHU FEN – fullname: LEE CHIH TSUNG |
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RelatedCompanies | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
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Snippet | The present invention relates to an ultraviolet ray (UV) curing system for processing a semiconductor substrate such as a wafer. The UV curing system comprise;... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | UV CURING SYSTEM FOR SEMICONDUCTORS |
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