UV CURING SYSTEM FOR SEMICONDUCTORS

The present invention relates to an ultraviolet ray (UV) curing system for processing a semiconductor substrate such as a wafer. The UV curing system comprise; a processing chamber; a wafer supporting body for accepting the wafer within the processing chamber; a UV radiation source arranged on the p...

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Bibliographic Details
Main Authors CHEN CHIA HO, LIEN MING HUEI, CHOU YOU HUA, WU SHU FEN, LEE CHIH TSUNG
Format Patent
LanguageEnglish
Korean
Published 11.12.2013
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Summary:The present invention relates to an ultraviolet ray (UV) curing system for processing a semiconductor substrate such as a wafer. The UV curing system comprise; a processing chamber; a wafer supporting body for accepting the wafer within the processing chamber; a UV radiation source arranged on the processing chamber; and a UV penetrability window arranged between the UV radiation source and the wafer supporting body. The wafer supporting body is provided by a belt conveyor which is operated to transfer the wafer through the processing chamber during UV curing in one example. The UV radiation source is a movable lamp unit which moves across the top of the processing chamber for irradiating the wafer in the other example. The UV penetrability window comprises a UV radiation corrector in the other example. The UV radiation corrector decreases the intensity of UV radiation for a part of the wafer located under the UV radiation corrector. Various examples improve wafer curing uniformity by normalizing a UV intensity level for the wafer. [Reference numerals] (122) UV lamp;(130) Explanation window;(AA) Cooling gas;(BB) Cooling / cleaning gas;(CC) Vacuum source
Bibliography:Application Number: KR20120112993