GUIDE FOR ALIGNING WAFER

The present invention relates to a wafer aligning guide, and, more specifically, to a wafer aligning guide which is capable not only of reducing replacement costs and hours by configuring an aligning plate to be rotated and turned over for reuse, but of reducing production costs by replacing only th...

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Main Author LEE, MOON JIN
Format Patent
LanguageEnglish
Korean
Published 27.11.2013
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Abstract The present invention relates to a wafer aligning guide, and, more specifically, to a wafer aligning guide which is capable not only of reducing replacement costs and hours by configuring an aligning plate to be rotated and turned over for reuse, but of reducing production costs by replacing only the aligning plate without replacing the entire wafer aligning guide, and of promoting productivity by aligning the wafer without stopping the moving wafer. The wafer aligning guide according to the present invention provides a pair of supporters arranged to be mutually faced on both sides of a conveyor; a cover detachable to the supporters by being located at the upper side of the supporters; and a pair of aligning plates detachably arranged in between the supporters and the cover, and aligning the wafer by being contacted with both sides of the wafer transferred by the conveyor.
AbstractList The present invention relates to a wafer aligning guide, and, more specifically, to a wafer aligning guide which is capable not only of reducing replacement costs and hours by configuring an aligning plate to be rotated and turned over for reuse, but of reducing production costs by replacing only the aligning plate without replacing the entire wafer aligning guide, and of promoting productivity by aligning the wafer without stopping the moving wafer. The wafer aligning guide according to the present invention provides a pair of supporters arranged to be mutually faced on both sides of a conveyor; a cover detachable to the supporters by being located at the upper side of the supporters; and a pair of aligning plates detachably arranged in between the supporters and the cover, and aligning the wafer by being contacted with both sides of the wafer transferred by the conveyor.
Author LEE, MOON JIN
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Snippet The present invention relates to a wafer aligning guide, and, more specifically, to a wafer aligning guide which is capable not only of reducing replacement...
SourceID epo
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SubjectTerms BASIC ELECTRIC ELEMENTS
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
Title GUIDE FOR ALIGNING WAFER
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