SPUTTER AND METHOD FOR DEPOSITING THIN FILM USING THE SAME

• Main Authors: JEONG, JEONG YEONG, CHUNG, YUN MO, PARK, JONG RYUK, SEO, JIN WOOK
• Format: Patent
• Language: English; Korean
• Published: 20.11.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The embodiment of the present invention relates to a sputter, wherein the sputter according to the embodiment of present invention includes: a cathode part including a cathode body and a target supporting part, wherein a target is placed on the front side of the cathode body, and the target supporting part is coupled to the front edge of the cathode part and supports the edge of the target; an anode part including an anode body and an anode electrode, wherein the anode body surrounds the side and the rear side of the cathode part, and the anode electrode being coupled to the anode body covers the target and the partial edge of the target with separation; an inner insulating body being place between the cathode part and the anode body; an electrode insulating body being placed in a space in which the anode electrode, the target supporting part, and the partial edge of the target are separated with one another; and a power supply part being connected to the cathode part and the anode part.