WAFER ETCHING APPARATUS FOR MANUFACTURING SOLAR CELL

• Main Authors: WI, IL HWAN, WOO, SUNG HOON, KANG, JIN MO, KIM, JI HYUN, KIM, YEON KYUNG, YANG, SU MI, KIM, MYUN SU
• Format: Patent
• Language: English; Korean
• Published: 04.11.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

The present invention relates to a substrate etching device for manufacturing solar cells and includes a bath which accommodates the etching chemical; and multiple rollers which are placed inside the bath, transfer a substrate in a certain direction, and apply the etching chemical on the bottom surface of the substrate. By applying the etching chemical on the bottom surface of the substrate, a semiconductor layer formed on the bottom of the substrate is removed through a diffusion process during the manufacturing of a solar cell, and an isolation process can be performed by removing only part of the semiconductor layer formed on the lateral side of the substrate. As a result, removal of a semiconductor layer formed on the top of the substrate is prevented during a wet isolation process, and thus damage to an effective light receiving surface on the top of the substrate is prevented. [Reference numerals] (AA) Etching chemical