LASER MACHINING METHOD AND LASER MACHINING APPARATUS

PURPOSE: A laser processing method and a laser processing device are provided to form a laser processing hole reaching from a first member to a second member and to prevent the generation of cracks even though pulse laser beams are close to the first and second members. CONSTITUTION: A laser process...

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Bibliographic Details
Main Author MORIKAZU HIROSHI
Format Patent
LanguageEnglish
Korean
Published 11.10.2013
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A laser processing method and a laser processing device are provided to form a laser processing hole reaching from a first member to a second member and to prevent the generation of cracks even though pulse laser beams are close to the first and second members. CONSTITUTION: A laser processing method is as follows: a step of detecting the wavelength of plasma light generated by radiating laser beams to first and second members; a step of continuously radiating pulse laser beams with a first output until only the plasma light with the wavelength of the first member is detected and the light intensity of the plasma light is decreased to a predetermined value; a step of radiating pulse laser beams with a second output when the light intensity of the plasma light is reached to the predetermined value; and a step of stopping the radiation of the pulse laser beams when the plasma light with the wavelength of the second member is detected.
Bibliography:Application Number: KR20130033545