SUBSTRATE FOR OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A substrate for an optical semiconductor device, a manufacturing method thereof, an optical semiconductor device, and a manufacturing method thereof manufacture an optical semiconductor device with high durability and high heat dissipation at low costs by integrally forming a first lead fra...

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Bibliographic Details
Main Authors FUKASAWA HIROYUKI, GOTO WATARU
Format Patent
LanguageEnglish
Korean
Published 08.10.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A substrate for an optical semiconductor device, a manufacturing method thereof, an optical semiconductor device, and a manufacturing method thereof manufacture an optical semiconductor device with high durability and high heat dissipation at low costs by integrally forming a first lead frame and a second lead frame with resin and bonding a resin frame. CONSTITUTION: A light emitting device is mounted on a first lead frame (2). A second lead frame (3) is electrically connected to the light emitting device. The first lead frame and the second lead frame are integrally formed with resin (6). A base part (4) is formed by a transfer mold. A resin frame (5) is bonded on a region where the light emitting device of the base part is mounted. The resin frame is bonded by printing coating or dispenser coating.
Bibliography:Application Number: KR20130031897