THIN PCB SUBSTRATE HAVING VIA LAYER AND METHOD OF MANUFACTURING THE SAME

• Main Authors: CHA, SANG SUK, KIM, HYUN WUK, SHIM, JAE CHUL, JUNG, CHANG BO, OH, CHOON HWAN
• Format: Patent
• Language: English; Korean
• Published: 01.10.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE: A printed circuit board including a via layer and a manufacturing method thereof are provided to improve connectivity between layers by forming a copper plating layer on a base copper layer. CONSTITUTION: A carrier substrate including a base copper layer is provided (310). On the base copper layer, a laminated substrate structure is formed (320). Through the selective processing of an insulating material layer, a via hole is formed (330). A copper conductive layer is formed on the upper part of the insulating material layer (340). By separating an insulating core layer, a base substrate is formed (350). [Reference numerals] (310) Carrier substrate with base copper layers laminated on its two sides of an insulation core layer is provided; (320) On the base copper layer of the carrier substrate, a laminated substrate structure is formed by laminating an insulation material layer; (330) Via hole, which partially exposes the base copper layer, is formed by selectively processing the insulation material layers; (340) Copper via layer and a copper conductive layer are formed inside the via hole and on the insulation material layer using a plating method; (350) Base substrate is formed by separating the insulation core layer from the laminated substrate structure; (AA) Start; (BB) End