MEMS MICROPHONE PCB AND METHOD FOR MANUFACTURING THE PCB

• Main Authors: LEE, YUNG WOO, CHO, EUNNARA, HWANG, CHAN HA, JUNG, JONG DAE
• Format: Patent
• Language: English; Korean
• Published: 25.09.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PUBLIC ADDRESS SYSTEMS; TRANSPORTING

PURPOSE: A microelectromechanical systems (MEMS) microphone printed circuit board is provided to have an effect of preventing a generation of a void from a solvent by discharging a solvent through hole during the hardening of a solder paste. CONSTITUTION: A microelectromechanical systems (MEMS) microphone package comprises in order to form multiple air emitting holes (500) in a boundary area between MEMS microphone devices (450) on the lower printed circuit board (200); and the boundary area between units (400) on the upper part printed circuit board (100). The upper, lower printed circuit board comprises: a unit area; a boundary area. The unit area comprises by including multiple units for the microphone. The boundary area comprises to form more than one hole between multiple units. The hole is comprised in order to form more than one hole in the vicinity of each vertex of the unit, and in the vicinity of each edge of the unit.