METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

• Main Authors: YANG, DEK GIN, LEE, YANG JE, SHIN, JAE HO
• Format: Patent
• Language: English; Korean
• Published: 03.09.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A rigid flexible printed circuit board manufacturing method is provided to include a step preparing an oxidation prevention protecting layer, thereby improving the reliability of a product by protecting a ductility film in a circuit layer removal process of a flexible region. CONSTITUTION: A rigid flexible printed circuit board manufacturing method is comprised of the following steps: a step of providing a ductility film (100) in which a metal layer (110) is formed at one side or both sides; a step of forming a circuit pattern by patterning the metal layer; a step of forming a stopper metal layer (120) on the metal layer of a flexible region (F); a step of preparing an oxidation prevention protecting layer (130) on the stopper metal layer, which enables welding a bonding sheet for fixing the stopper metal layer and the oxidation prevention protecting layer; a step of laminating at least one circuit layer (200) on an insulation film; and finally, a step of removing the circuit layer of the flexible region.