LAMINATED BODY AND LAMINATED CIRCUIT BOARD

A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling occurs during the production process. The laminated body is formed of an inorganic layer such as glass plate and silicon wafer, and a polyim...

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Main Authors TSUTSUMI MASAYUKI, OKAMOTO JUN, MAEDA SATOSHI, TSUTIYA TOSHIYUKI, WAKUI HIROYUKI, OKUYAMA TETSUO, YOSHIDA TAKEHUMI
Format Patent
LanguageEnglish
Korean
Published 02.09.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Abstract A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling occurs during the production process. The laminated body is formed of an inorganic layer such as glass plate and silicon wafer, and a polyimide film obtained by reaction between an aromatic tetracarboxylic acid and an aromatic diamine and having a coefficient of linear expansion in a predetermined range, the inorganic layer and the polyimide film form a laminate without an adhesive layer therebetween, and the 180-degree peel strength between the polyimide film and the inorganic layer of the laminated body is within a predetermined range.
AbstractList A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling occurs during the production process. The laminated body is formed of an inorganic layer such as glass plate and silicon wafer, and a polyimide film obtained by reaction between an aromatic tetracarboxylic acid and an aromatic diamine and having a coefficient of linear expansion in a predetermined range, the inorganic layer and the polyimide film form a laminate without an adhesive layer therebetween, and the 180-degree peel strength between the polyimide film and the inorganic layer of the laminated body is within a predetermined range.
Author TSUTSUMI MASAYUKI
WAKUI HIROYUKI
OKAMOTO JUN
MAEDA SATOSHI
OKUYAMA TETSUO
TSUTIYA TOSHIYUKI
YOSHIDA TAKEHUMI
Author_xml – fullname: TSUTSUMI MASAYUKI
– fullname: OKAMOTO JUN
– fullname: MAEDA SATOSHI
– fullname: TSUTIYA TOSHIYUKI
– fullname: WAKUI HIROYUKI
– fullname: OKUYAMA TETSUO
– fullname: YOSHIDA TAKEHUMI
BookMark eNrjYmDJy89L5WTQ8nH09fRzDHF1UXDyd4lUcPRzUUAIOXsGOYd6hgClHINceBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhsYGBpbmRiYmjMXGqAK2WJuU
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID KR20130097244A
GroupedDBID EVB
ID FETCH-epo_espacenet_KR20130097244A3
IEDL.DBID EVB
IngestDate Fri Jul 19 15:23:59 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
Korean
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_KR20130097244A3
Notes Application Number: KR20137020736
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130902&DB=EPODOC&CC=KR&NR=20130097244A
ParticipantIDs epo_espacenet_KR20130097244A
PublicationCentury 2000
PublicationDate 20130902
PublicationDateYYYYMMDD 2013-09-02
PublicationDate_xml – month: 09
  year: 2013
  text: 20130902
  day: 02
PublicationDecade 2010
PublicationYear 2013
RelatedCompanies TOYOBO CO., LTD
RelatedCompanies_xml – name: TOYOBO CO., LTD
Score 2.87244
Snippet A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling...
SourceID epo
SourceType Open Access Repository
SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
Title LAMINATED BODY AND LAMINATED CIRCUIT BOARD
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130902&DB=EPODOC&locale=&CC=KR&NR=20130097244A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMU5OtTCxTDIF7ehJ1TWxNDLXTbJMStM1TzYCUsnmZibgm-d8_cw8Qk28IkwjmBhyYHthwOeEloMPRwTmqGRgfi8Bl9cFiEEsF_DaymL9pEygUL69W4itixq0dwwskC0NjNRcnGxdA_xd_J3VnJ1tvYPU_IIgcqCjakxMHJkZWEENadBJ-65hTqB9KQXIlYqbIANbANC8vBIhBqbsfGEGTmfY3WvCDBy-0ClvIBOa-4pFGLR8HH09_RyBZY2Ck79LpIKjn4sCQsjZM8g51DMEKOUY5CLKoOzmGuLsoQu0NB7ux3jvIGQXGosxsAB7_6kSDArGacDANDC0SEwxNTcxA1avQBrUSrEA9qNMEs2NJBlk8JkkhV9amoHLCHy_g6WugZEMA0tJUWmqLLCWLUmSAwcOAKHIeZU
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dT8Iw8IJoxDdFjR-oSzR7MFkcpaPbAzGjZdmEDbIMg0-EzZEYjRCZ8e97rSA88dTmLrm2l9xX27sDuGtkuU2d1JIZPblBHcKM1EmnBssIDhlrUtV5Loya_pA-jaxRCT5WuTCqTuiPKo6IEpWhvBdKX8_Xl1hC_a1cPKRvCJo9eklL6MvoGBWyYxJdtFudQV_0uc55qxvrUfyHk6VqKHV3YJfJ-rzSeXpuy7yU-aZR8Q5hb4D0PosjKL3PqlDhq95rVdgPl0_eOF1K3-IY7ntuGEQu6hqt3RcvmhsJbQ3iQcyHQYIoNxYncOt1Eu4buOj4_4zjbry5w8YplDH6z89Aa0yRmWbdnrxajDbRvOIovRQb4yg6YeQcatsoXWxH30DFT8LeuBdE3Us4IKrXg2OYpAbl4us7v0KLW6TXilG_eX58gg
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=LAMINATED+BODY+AND+LAMINATED+CIRCUIT+BOARD&rft.inventor=TSUTSUMI+MASAYUKI&rft.inventor=OKAMOTO+JUN&rft.inventor=MAEDA+SATOSHI&rft.inventor=TSUTIYA+TOSHIYUKI&rft.inventor=WAKUI+HIROYUKI&rft.inventor=OKUYAMA+TETSUO&rft.inventor=YOSHIDA+TAKEHUMI&rft.date=2013-09-02&rft.externalDBID=A&rft.externalDocID=KR20130097244A