LAMINATED BODY AND LAMINATED CIRCUIT BOARD

A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling occurs during the production process. The laminated body is formed of an inorganic layer such as glass plate and silicon wafer, and a polyim...

Full description

Saved in:
Bibliographic Details
Main Authors TSUTSUMI MASAYUKI, OKAMOTO JUN, MAEDA SATOSHI, TSUTIYA TOSHIYUKI, WAKUI HIROYUKI, OKUYAMA TETSUO, YOSHIDA TAKEHUMI
Format Patent
LanguageEnglish
Korean
Published 02.09.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:A laminated body for use in device production is provided with which positioning can be performed precisely, peeling after production is smooth, and no peeling occurs during the production process. The laminated body is formed of an inorganic layer such as glass plate and silicon wafer, and a polyimide film obtained by reaction between an aromatic tetracarboxylic acid and an aromatic diamine and having a coefficient of linear expansion in a predetermined range, the inorganic layer and the polyimide film form a laminate without an adhesive layer therebetween, and the 180-degree peel strength between the polyimide film and the inorganic layer of the laminated body is within a predetermined range.
Bibliography:Application Number: KR20137020736