APPARATUS FOR SCRIBING PANEL

PURPOSE: A substrate cutting apparatus is provided to break one substrate into plural unit substrates, and to finally break the unit substrates with a scribe line into cell units in a downstream process for reducing the substrate cutting time. CONSTITUTION: A substrate cutting apparatus includes a f...

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Bibliographic Details
Main Author PARK, SUNG MO
Format Patent
LanguageEnglish
Korean
Published 23.08.2013
Subjects
CHEMISTRY
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
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Summary:PURPOSE: A substrate cutting apparatus is provided to break one substrate into plural unit substrates, and to finally break the unit substrates with a scribe line into cell units in a downstream process for reducing the substrate cutting time. CONSTITUTION: A substrate cutting apparatus includes a first substrate processing unit (200) and a second substrate processing unit (300). The first substrate processing unit includes a scribing unit (201) and a first breaking unit (202). The scribing unit forms a scribe line on a substrate. The first breaking unit breaks the substrate into first and second unit substrates along the scribe line. The second unit substrate includes the scribe line. The second substrate processing unit includes a second breaking unit (310). The second breaking unit receives the second unit substrate from the first substrate processing unit, and breaks the second substrate along the scribe line.
Bibliography:Application Number: KR20120015257