LASER MACHINING APPARATUS

PURPOSE: A laser processing device is provided to form a laser processing hole which is continued from a first member to a second member on a workpiece connected with the first and second materials. CONSTITUTION: A laser processing device includes a workpiece maintaining member, a laser irradiating...

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Bibliographic Details
Main Author MORIKAZU HIROSHI
Format Patent
LanguageEnglish
Korean
Published 20.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A laser processing device is provided to form a laser processing hole which is continued from a first member to a second member on a workpiece connected with the first and second materials. CONSTITUTION: A laser processing device includes a workpiece maintaining member, a laser irradiating member, a plasma detecting member (9), and a control member. The plasma detecting member detects waves of plasma, which are generated by the pulse laser beams irradiated on a workpiece by the laser irradiating member. The plasma detecting member includes first and second band pass filters and first and second optical detectors. The control member controls laser irradiating member so that the irradiation of the pulse laser beams are stopped when the optical intensity output from the first optical detector is decreased, and optical intensity output from the second optical detector is increased over a peak value.
Bibliography:Application Number: KR20130012290