SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

PURPOSE: An apparatus and method for processing a substrate are provided to prevent thermal deformation by supplying processing solutions on a wafer through a spin head which is rotated at high speeds. CONSTITUTION: A substrate is loaded on a spin head. A chuck pin cleaning nozzle (80) is located on...

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Bibliographic Details
Main Author NOH, HWAN IK
Format Patent
LanguageEnglish
Korean
Published 13.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An apparatus and method for processing a substrate are provided to prevent thermal deformation by supplying processing solutions on a wafer through a spin head which is rotated at high speeds. CONSTITUTION: A substrate is loaded on a spin head. A chuck pin cleaning nozzle (80) is located on the lower side of the spin head. The chuck pin cleaning nozzle sprays cleaning solutions to a chuck pin (500). The chuck pin is installed on a body. A chuck pin moving unit is connected to the lower side of the chuck pin.
Bibliography:Application Number: KR20120011361