ELECTRONIC DEVICES WITH YIELDING SUBSTRATES

In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

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Bibliographic Details
Main Authors ASHDOWN IAN, SCHICK PHILIPPE, SHEEN CALVIN WADE, TISCHLER MICHAEL, JUNGWIRTH PAUL
Format Patent
LanguageEnglish
Korean
Published 06.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Bibliography:Application Number: KR20137002293