EVAPORATION MASK AND EVAPORATION APPARATUS USING THE SAME

• Main Authors: YOU, SUK BEOM, MOON, SEUNG JUN, LEE, JOO HWA, KWON, OH SEOB
• Format: Patent
• Language: English; Korean
• Published: 17.07.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A deposition mask and a deposition apparatus using the same are provided to improve precision by minimizing deviation on a slit pattern by the magnetic fiel. CONSTITUTION: A slit (32) is formed on a mask body (310). The slit comprises a deposition slit (321) and a dummy slit (328). The deposition slit is formed in a constant width. The dummy slit is formed around the deposition slit. A rib (305) is formed between the slit.